发明授权
US07151039B2 Method of forming oxide layer using atomic layer deposition method and method of forming capacitor of semiconductor device using the same
有权
使用原子层沉积法形成氧化物层的方法和使用其形成半导体器件的电容器的方法
- 专利标题: Method of forming oxide layer using atomic layer deposition method and method of forming capacitor of semiconductor device using the same
- 专利标题(中): 使用原子层沉积法形成氧化物层的方法和使用其形成半导体器件的电容器的方法
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申请号: US10632825申请日: 2003-08-04
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公开(公告)号: US07151039B2公开(公告)日: 2006-12-19
- 发明人: Yun-Jung Lee , In-Sung Park , Gi-Vin Im , Ki-Yeon Park , Jae-Hyun Yeo
- 申请人: Yun-Jung Lee , In-Sung Park , Gi-Vin Im , Ki-Yeon Park , Jae-Hyun Yeo
- 申请人地址: KR Kyungki-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Kyungki-do
- 代理机构: Harness, Dickey & Pierce, P.L.C.
- 优先权: KR10-2002-0048720 20020817
- 主分类号: H01L21/20
- IPC分类号: H01L21/20 ; H01L21/31
摘要:
In a method of forming an oxide layer using an atomic layer deposition and a method of forming a capacitor of a semiconductor device using the same, a precursor including an amino functional group is introduced onto a substrate to chemisorb a portion of the precursor on the substrate. Then, the non-chemisorbed precursor is removed. Thereafter, an oxidant is introduced onto the substrate to chemically react the chemisorbed precursor with the oxidant to form an oxide layer on the substrate. A deposition rate is fast and an oxide layer having a good deposition characteristic may be obtained. Also, a thin oxide film having a good step coverage and a decreased pattern loading rate can be formed.
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