发明授权
- 专利标题: In situ molded thermal barriers
- 专利标题(中): 原位模制热障
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申请号: US10655194申请日: 2003-09-04
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公开(公告)号: US07152385B2公开(公告)日: 2006-12-26
- 发明人: Michael D. Morgan , Xiudong Sun , Laura A. Tennenhouse , Robert A. Wiercinski , Benita Dair , Antonio J. Aldykiewicz, Jr. , Leon Bablouzian , Lawrence Shapiro , William J. Hurley, Jr.
- 申请人: Michael D. Morgan , Xiudong Sun , Laura A. Tennenhouse , Robert A. Wiercinski , Benita Dair , Antonio J. Aldykiewicz, Jr. , Leon Bablouzian , Lawrence Shapiro , William J. Hurley, Jr.
- 申请人地址: US MD Columbia
- 专利权人: W.R. Grace & Co.-Conn.
- 当前专利权人: W.R. Grace & Co.-Conn.
- 当前专利权人地址: US MD Columbia
- 代理商 Craig K. Leon
- 主分类号: E04C2/00
- IPC分类号: E04C2/00
摘要:
Methods, systems, and devices for installing barriers in openings of gaps in or between structures such as walls, ceilings, and floors are described herein. At least one barrier molding bag is positioned in the hole or gap, and a flowable firestop material that is preferably operative to cure or harden, such as a hydratable cementitious slurry, is introduced into the bag to create a barrier in the hole or gap.
公开/授权文献
- US20040045234A1 In situ molded thermal barriers 公开/授权日:2004-03-11