发明授权
- 专利标题： Cooling structure of electronic equipment and information processing equipment using the cooling structure
- 专利标题（中）： 冷却结构的电子设备和信息处理设备采用冷却结构
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申请号： US10767495申请日： 2004-01-28
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公开(公告)号： US07154748B2公开(公告)日： 2006-12-26
- 发明人: Satoru Yamada
- 申请人： Satoru Yamada
- 申请人地址： JP Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JP Kawasaki
- 代理机构： Greer, Burns & Crain, Ltd
- 优先权： JP2003-043105 20030220
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; G06F1/20
摘要：
A cooling structure of an electronic equipment includes substrate housing parts, an upstream side duct, a downstream side duct, an exhaust device and an air adjusting part. The substrate housing parts detachably house therein one or plurality of substrate units, and the downstream side duct allows the cooling air, which passed from the upstream side duct though the substrate housing part, to flow. The exhaust device is provided at an exhaust part to forcibly discharge air to the outside, thereby allowing the cooling air to flow to the substrate housing parts. The air adjusting part adjusts the volume for cooling air which flows to the downstream side duct.
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