Invention Grant
- Patent Title: Wet etching apparatus
- Patent Title (中): 湿式蚀刻装置
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Application No.: US10740111Application Date: 2003-12-17
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Publication No.: US07156948B2Publication Date: 2007-01-02
- Inventor: Chi-An Lin , Kuo-Hung Kuo , Ta-Hsin Kuan , Po-Yi Lo , Ming-Hsien Yang
- Applicant: Chi-An Lin , Kuo-Hung Kuo , Ta-Hsin Kuan , Po-Yi Lo , Ming-Hsien Yang
- Applicant Address: TW Chu-Nan
- Assignee: TPO Displays Corp.
- Current Assignee: TPO Displays Corp.
- Current Assignee Address: TW Chu-Nan
- Agency: Liu & Liu
- Priority: TW92209612U 20030526
- Main IPC: H01L21/306
- IPC: H01L21/306 ; B44C1/22
Abstract:
A wet etching apparatus is disclosed. The apparatus comprises a first tank, containing a first wet etching solution; a filter, having a filter cartridge, connected to the first tank to filter out the impurities in the first solution; a second etching tank, connected to the filter and the first tank in parallel, containing a second solution; a reaction tank, connected to the filter, wherein having a wet etching reaction; an exhaust component, connected to the filter and the reaction tank in parallel; a first pump, delivering the first solution to the reaction tank through the filter; and a second pump, delivering the second solution to the exhaust component to exhaust the solution from the etching tank through the filter.
Public/Granted literature
- US20040238120A1 Wet etching apparatus Public/Granted day:2004-12-02
Information query
IPC分类:
