Invention Grant
US07158663B2 Method for measuring confidence of ball grid array model in surface mounted devices
有权
用于测量表面安装装置中球栅阵列模型的置信度的方法
- Patent Title: Method for measuring confidence of ball grid array model in surface mounted devices
- Patent Title (中): 用于测量表面安装装置中球栅阵列模型的置信度的方法
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Application No.: US10420286Application Date: 2003-04-22
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Publication No.: US07158663B2Publication Date: 2007-01-02
- Inventor: Tong Fang , Ming Fang
- Applicant: Tong Fang , Ming Fang
- Applicant Address: US NJ Princeton
- Assignee: Siemens Corporate Research, Inc.
- Current Assignee: Siemens Corporate Research, Inc.
- Current Assignee Address: US NJ Princeton
- Agency: F.Chau & Associates, LLC
- Agent Donald B. Paschburg
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
A method for obtaining confidence measure of a ball grid array (BGA) model having a plurality of balls in semiconductor surface mounted devices is provided. The method comprises the steps of extracting BGA images from a real surface mounted device, generating a BGA ball model and a BGA body model, generating a first confidence measure of the BGA ball model wherein the first confidence measure includes a first standard deviation of the BGA ball model and a first local image contrast of each BGA ball, and generating a second confidence measure of the BGA body model wherein the second confidence measure includes a second standard deviation of the BGA body model and a second local image contrast of the BGA body.
Public/Granted literature
- US20040213451A1 Method for measuring confidence of ball grid array model in surface mounted devices Public/Granted day:2004-10-28
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