A stress-release mold is described for casting thermosetting compositions especially compositions designed for consumer use. At least one wall of the mold includes a stress-releasing-element characterized by having a more flexible region or regions than the remaining wall or walls of the mold and wherein the stress-releasing-element includes a region of lower curvature at least partially surrounded by a region of higher curvature. The stress-release mold greatly reduces or eliminates surface defects caused by shrinkage of thermosetting compositions as they cools. A system is also described that includes the inventive mold containing a thermosetting composition wherein the mold also serves as all or part of the package for the composition.