Invention Grant
- Patent Title: Methods for integrated implant monitoring
- Patent Title (中): 综合植入物监测方法
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Application No.: US10894357Application Date: 2004-07-19
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Publication No.: US07160742B2Publication Date: 2007-01-09
- Inventor: Kenneth Steeples
- Applicant: Kenneth Steeples
- Applicant Address: US MA Billerica
- Assignee: QC Solutions, Inc.
- Current Assignee: QC Solutions, Inc.
- Current Assignee Address: US MA Billerica
- Agency: Kirkpatrick & Lockhart Nicholson Graham, LLP
- Main IPC: H01L21/66
- IPC: H01L21/66
Abstract:
The invention relates to a method for real-time in-situ implantation and measurement incorporating a feedback loop to adjust the implantation dose of a substrate during the manufacturing and testing of semiconductor wafers. During processing, the substrate, such as a silicon wafer, is transported between a measuring device and an implantation device multiple times to ensure that where the beam from the implantation device hits the substrate, the doping concentration falls within the range of desired parameters.
Public/Granted literature
- US20050074909A1 Integrated implant monitor for closed loop control Public/Granted day:2005-04-07
Information query
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