Invention Grant
- Patent Title: Wafer edge inspection
- Patent Title (中): 晶圆边缘检查
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Application No.: US11196540Application Date: 2005-08-03
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Publication No.: US07161668B2Publication Date: 2007-01-09
- Inventor: Steven W. Meeks , Rusmin Kudinar , William R. Wheeler , Hung Phi Nguyen
- Applicant: Steven W. Meeks , Rusmin Kudinar , William R. Wheeler , Hung Phi Nguyen
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Technologies Corporation
- Current Assignee: KLA-Tencor Technologies Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Caven & Aghevli LLC
- Main IPC: G01N21/88
- IPC: G01N21/88
Abstract:
In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target a radiation beam onto a surface; and a reflected radiation collecting assembly that collects radiation reflected from the surface, wherein the reflected radiation collecting assembly comprises a mirror to collect radiation reflected from the surface.
Public/Granted literature
- US20060250610A1 Wafer edge inspection Public/Granted day:2006-11-09
Information query
