摘要:
A system and method for performing a magnetic imaging, optical profiling, and measuring lubricant thickness and degradation, carbon wear, carbon thickness, and surface roughness of thin film magnetic disks and silicon wafers at angles that are not substantially Brewster's angle of the thin film (carbon) protective overcoat is provided. The system and method involve a focused optical light whose polarization can be switched between P or S polarization is incident at an angle to the surface of the thin film magnetic disk. This generates both reflected and scattered light that may be measured to determine various values and properties related to the surface of the disk, including identifying the Kerr-effect in reflected light for determination of point magnetic properties. In addition, the present invention can mark the position of an identified defect.
摘要:
An optical inspector includes a radiating source, a time varying beam reflector, a telecentric scan lens, a first and second waveplate, a polarizing beam splitter, a first detector, a focusing lens, a blocker, and a second detector. The radiating source irradiates the first waveplate generating circularly polarized source beam that irradiates a first position of on the time varying beam reflector with a source beam. The time varying beam reflector directs the source beam to the telecentric scan lens, which in turn directs the source beam to a sample. Reflected radiation from a sample is directed to the second waveplate generating linearly polarized beam that irradiates the polarizing beam splitter which directs a portion of the reflected radiation to the first detector. Scattered radiation from the sample is directed by the focusing lens to the second detector. Contemporaneous measurements by the first and second detectors are compared to differentiate.
摘要:
An optical inspector includes a radiating source, a time varying beam reflector, a telecentric scan lens, a blocker, a focusing lens, an aperture, and a detector. The radiating source irradiates a first position of on the time varying beam reflector with a source beam. The time varying beam reflector directs the source beam to the telecentric scan lens, which in turn directs the source beam to a transparent sample. A portion of the source beam travels through the transparent sample to another surface. The blocker blocks scattered radiation originating at the other surface. Scattered radiation originating from the transparent sample is not redirected by the blocker and is focused by the focusing lens to a first focal plane. The focused scattered radiation passes through the aperture before irradiating the detector. The detector output an intensity measurement of the scattered radiation that irradiates the detector.
摘要:
In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target radiation onto an edge surface of a wafer, the radiation targeting assembly comprising a first expanded paraboloid or expanded ellipsoid reflector positioned adjacent the edge surface of the wafer, a reflected radiation collecting assembly that collects radiation reflected from the surface, a signal processing module to generate surface parameter data from the reflected radiation, and a defect detection module to analyze the surface parameter data to detect a defect on the surface.
摘要:
In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target a radiation beam onto a surface; and a reflected radiation collecting assembly that collects radiation reflected from the surface, wherein the reflected radiation collecting assembly comprises a mirror to collect radiation reflected from the surface.
摘要:
In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target a radiation beam onto a surface; and a reflected radiation collecting assembly that collects radiation reflected from the surface, wherein the reflected radiation collecting assembly comprises a mirror to collect radiation reflected from the surface.
摘要:
A system and method for performing a magnetic imaging, optical profiling, and measuring lubricant thickness and degradation, carbon wear, carbon thickness, and surface roughness of thin film magnetic disks at angles that are not substantially Brewster's angle of the thin film protective overcoat.
摘要:
A system and method for performing a magnetic imaging, optical profiling, and measuring lubricant thickness and degradation, carbon wear, carbon thickness, and surface roughness of thin film magnetic disks and silicon wafers at angles that are not substantially Brewster's angle of the thin film (carbon) protective overcoat is provided. The system and method involve a focused optical light whose polarization can be switched between P or S polarization is incident at an angle to the surface of the thin film magnetic disk. This generates both reflected and scattered light that may be measured to determine various values and properties related to the surface of the disk, including identifying the Kerr-effect in reflected light for determination of point magnetic properties. In addition, the present invention can mark the position of an identified defect.
摘要:
A wafer handler featuring a carriage movable along a rail path, the carriage supporting an upright rotatable arm with a cantilevered wafer chuck. Elevators for raising and lowering trays containing wafer stacks are disposed on either side of the rail path. Each elevator has a curved track section which may be interposed along the rail path. The upright arm has a track follower, parallel to a boom supporting the wafer chuck and freely movable along the rail path, except when it encounters a curved track section. In this instance, the track follower will follow the curved track section, causing rotation of the arm, boom and wafer chuck, bringing the chuck into the wafer stack at an elevation determined by the elevator. In this manner, motion in the X, Y and Z planes may be provided for stacked wafers over extended distances.