发明授权
US07163982B2 Process for preparing fluorine-containing polymer and method of forming fine pattern using same
失效
制备含氟聚合物的方法和使用其形成精细图案的方法
- 专利标题: Process for preparing fluorine-containing polymer and method of forming fine pattern using same
- 专利标题(中): 制备含氟聚合物的方法和使用其形成精细图案的方法
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申请号: US10914203申请日: 2004-08-10
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公开(公告)号: US07163982B2公开(公告)日: 2007-01-16
- 发明人: Takayuki Araki , Tetsuhiro Kodani , Takuji Ishikawa
- 申请人: Takayuki Araki , Tetsuhiro Kodani , Takuji Ishikawa
- 申请人地址: JP Osaka
- 专利权人: Daiki Industries, Ltd.
- 当前专利权人: Daiki Industries, Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: Sughrue Mion, PLLC
- 优先权: JP2003-292899 20030813; JP2003-389289 20031119; JP2004-016166 20040123
- 主分类号: C08F8/32
- IPC分类号: C08F8/32
摘要:
There is provided a method of forming a fine pattern by using a practicable fluorine-containing polymer which has a high transparency to exposure light having a short wavelength such as F2 laser and can undergo resolution of a fine pattern. The method comprises (I) a step for preparing a fluorine-containing polymer (A) having OH group which has a structural unit derived from a fluorine-containing norbornene derivative having OH group, (II) a step for preparing a fluorine-containing polymer (B) having a protective group by reacting a compound represented by X—CH2OR, wherein X is Cl, Br or I; R is a hydrocarbon group having 1 to 30 carbon atoms in which a part or the whole of hydrogen atoms may be substituted with fluorine atoms, with the above-mentioned fluorine-containing polymer (A) having OH group in the presence of a base, (III) a step for preparing a resist composition comprising (a) the above-mentioned fluorine-containing polymer (B) having a protective group, (b) a photoacid generator and (c) a solvent, (IV) a step for forming a resist film comprising the above-mentioned resist composition on a substrate or on a given layer on the substrate, (V) a step for exposing by selectively irradiating a given area of the resist film with energy rays, and (VI) a step for subjecting the exposed resist film to developing to selectively remove the exposed portion of the resist film, thus forming a fine pattern.