Invention Grant
- Patent Title: Systems and methods using expandable bodies to push apart cortical bone surfaces
- Patent Title (中): 使用可膨胀体推动皮质骨表面的系统和方法
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Application No.: US10010576Application Date: 2001-11-13
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Publication No.: US07166121B2Publication Date: 2007-01-23
- Inventor: Mark A Reiley , Arie Scholten , Karen D Talmadge
- Applicant: Mark A Reiley , Arie Scholten , Karen D Talmadge
- Applicant Address: US CA Sunnyvale
- Assignee: Kyphon Inc.
- Current Assignee: Kyphon Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Ryan Kromholz & Manion, S.C.
- Main IPC: A61M29/00
- IPC: A61M29/00 ; A61F2/28 ; A61B19/00

Abstract:
Systems and methods insert an expandable body in a collapsed configuration into a space defined between cortical bone surfaces. The space can, e.g., comprise a fracture or an intervertebral space. The systems and methods cause expansion of the expandable body within the space, thereby pushing apart the cortical bone surfaces to, e.g., reduce the fracture or push apart adjacent vertebral bodies as part of a therapeutic procedure.
Public/Granted literature
- US20020082608A1 Systems and methods using expandable bodies to push apart cortical bone surfaces Public/Granted day:2002-06-27
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