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发明授权
US07169327B2 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof 有权
电介质复合颗粒，超微晶复合树脂颗粒，用于形成电介质的组合物及其用途

Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof
摘要：
The dielectric-forming composition according to the invention is characterized by consisting of: composite particles for dielectrics in which part or all of the surfaces of inorganic particles with permittivity of 30 or greater are coated with a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material; and (B) a resin component constituted of at least one of a polymerizable compound and a polymer. In addition, another dielectric-forming composition according to the invention is characterized by containing: ultrafine particle-resin composite particles composed of (J) inorganic ultrafine particles with the average particle size of 0.1 μm or smaller, and (B) a resin component constituted of at least one of a polymerizable compound and a polymer, wherein part or all of the surfaces of the inorganic ultrafine particles (J) are coated with the resin component (B), and the ultrafine particle-resin composite particles contain 20% by weight or more of the inorganic ultrafine particles (J); and inorganic particles with the average particle size of 0.1 to 2 μm and permittivity of 30 or greater, or inorganic composite particles in which a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material is deposited on the part or all of the surfaces of the inorganic particles.
摘要（中）：

根据本发明的电介质形成组合物的特征在于：电介质复合颗粒，其中介电常数为30或更大的无机颗粒的部分或全部表面涂覆有导电金属或其化合物，或导电 有机化合物或导电无机材料; 和（B）由聚合性化合物和聚合物中的至少一种构成的树脂成分。 此外，根据本发明的另一种电介质形成组合物的特征在于包含：由（J）平均粒径为0.1μm以下的（J）无机超微粒子构成的超微粒子 - 树脂复合粒子，（B）构成的树脂成分 的可聚合化合物和聚合物中的至少一种，其中无机超细颗粒（J）的一部分或全部表面涂覆有树脂组分（B），超细颗粒 - 树脂复合颗粒含有20重量％ 或更多的无机超细颗粒（J）; 和平均粒径为0.1〜2μm，介电常数为30以上的无机粒子，或其中导电性金属或其化合物或导电性有机化合物或导电性无机材料沉积在该部分上的无机复合粒子，或 无机颗粒的所有表面。

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