发明授权
- 专利标题: Method of forming dual gate dielectric layer
- 专利标题(中): 形成双栅介电层的方法
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申请号: US10964170申请日: 2004-10-12
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公开(公告)号: US07169681B2公开(公告)日: 2007-01-30
- 发明人: Min-Hee Cho , Ji-Young Kim
- 申请人: Min-Hee Cho , Ji-Young Kim
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Marger Johnson & McCollom, P.C.
- 优先权: KR10-2003-0071304 20031014
- 主分类号: H01L21/76
- IPC分类号: H01L21/76
摘要:
A method of forming a dual gate dielectric layer increases a performance of a semiconductor device by using a dielectric layer having a high dielectric constant, including forming a first dielectric layer having a predetermined thickness on a semiconductor substrate; removing the first dielectric layer formed on a second region, but leaving this layer on a first region; and forming a second dielectric layer having a dielectric constant higher than that of the first dielectric layer, on the first and second regions.
公开/授权文献
- US20050282352A1 Method of forming dual gate dielectric layer 公开/授权日:2005-12-22
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