Invention Grant
- Patent Title: Methods for forming cobalt layers including introducing vaporized cobalt precursors and methods for manufacturing semiconductor devices using the same
- Patent Title (中): 用于形成钴层的方法包括引入蒸发的钴前体和使用其制备半导体器件的方法
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Application No.: US10924034Application Date: 2004-08-23
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Publication No.: US07172967B2Publication Date: 2007-02-06
- Inventor: Hyun-Su Kim , Gil-Heyun Choi , Sang-Bom Kang , Woong-Hee Sohn , Jong-Ho Yun , Kwang-Jin Moon
- Applicant: Hyun-Su Kim , Gil-Heyun Choi , Sang-Bom Kang , Woong-Hee Sohn , Jong-Ho Yun , Kwang-Jin Moon
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR10-2003-0065572 20030922
- Main IPC: H01L21/44
- IPC: H01L21/44

Abstract:
The present invention provides methods for forming cobalt silicide layers, including introducing a vaporized cobalt precursor onto a silicon substrate to form a cobalt layer. The vaporized cobalt precursor has the formula Co2(CO)6(R1—C≡C—R2), wherein R1 is H or CH3, and R2 is H, t-butyl, methyl or ethyl. The silicon substrate is thermally treated so that silicon is reacted with cobalt to form a cobalt silicide layer. Methods for manufacturing semiconductor devices including the cobalt silicide layers described herein and such devices are also provided.
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