发明授权
- 专利标题: Silicon carbide semiconductor device and manufacturing method
- 专利标题(中): 碳化硅半导体器件及其制造方法
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申请号: US10230115申请日: 2002-08-29
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公开(公告)号: US07173284B2公开(公告)日: 2007-02-06
- 发明人: Rajesh Kumar , Tsuyoshi Yamamoto , Hiroki Nakamura
- 申请人: Rajesh Kumar , Tsuyoshi Yamamoto , Hiroki Nakamura
- 申请人地址: JP Kariya
- 专利权人: Denso Corporation
- 当前专利权人: Denso Corporation
- 当前专利权人地址: JP Kariya
- 代理机构: Posz Law Group, PLC
- 优先权: JP2001-260210 20010829; JP2002-216665 20020725
- 主分类号: H01L29/15
- IPC分类号: H01L29/15
摘要:
A silicon carbide semiconductor device that includes J-FETs has a drift layer of epitaxially grown silicon carbide having a lower impurity concentration level than a substrate on which the drift layer is formed. Trenches are formed in the surface of the drift layer, and first gate areas are formed on inner walls of the trenches. Second gate areas are formed in isolation from the first gate areas. A source area is formed on channel areas, which are located between the first and second gate areas in the drift layer. A method of manufacturing the device ensures uniform channel layer quality, which allows the device to have a normally-off characteristic, small size, and a low likelihood of defects.
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