Invention Grant
- Patent Title: Silicon carbide semiconductor device and manufacturing method
- Patent Title (中): 碳化硅半导体器件及其制造方法
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Application No.: US10230115Application Date: 2002-08-29
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Publication No.: US07173284B2Publication Date: 2007-02-06
- Inventor: Rajesh Kumar , Tsuyoshi Yamamoto , Hiroki Nakamura
- Applicant: Rajesh Kumar , Tsuyoshi Yamamoto , Hiroki Nakamura
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2001-260210 20010829; JP2002-216665 20020725
- Main IPC: H01L29/15
- IPC: H01L29/15

Abstract:
A silicon carbide semiconductor device that includes J-FETs has a drift layer of epitaxially grown silicon carbide having a lower impurity concentration level than a substrate on which the drift layer is formed. Trenches are formed in the surface of the drift layer, and first gate areas are formed on inner walls of the trenches. Second gate areas are formed in isolation from the first gate areas. A source area is formed on channel areas, which are located between the first and second gate areas in the drift layer. A method of manufacturing the device ensures uniform channel layer quality, which allows the device to have a normally-off characteristic, small size, and a low likelihood of defects.
Public/Granted literature
- US20030042491A1 Silicon carbide semiconductor device and manufacturing method Public/Granted day:2003-03-06
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