发明授权
- 专利标题： Hermetic sealing cap and method of manufacturing the same
- 专利标题（中）： 密封盖及其制造方法
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申请号： US10926102申请日： 2004-08-26
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公开(公告)号： US07173331B2公开(公告)日： 2007-02-06
- 发明人: Shigeji Matsubara , Masaharu Yamamoto , Toshiaki Fukusako , Yoshito Tagashira
- 申请人： Shigeji Matsubara , Masaharu Yamamoto , Toshiaki Fukusako , Yoshito Tagashira
- 申请人地址： JP Osaka
- 专利权人： Neomax Materials Co., Ltd.
- 当前专利权人： Neomax Materials Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Westerman, Hattori, Daniels & Adrian, LLP.
- 主分类号： H01L23/12
- IPC分类号： H01L23/12
摘要：
A hermetic sealing cap member capable of suppressing deterioration of characteristics of an electronic component resulting from a sealant such as solder coming into contact with the electronic component in a package is obtained. This hermetic sealing cap, which is a hermetic sealing cap employed for an electronic component storing package for storing an electronic component (5, 34), comprises a hermetic sealing cap member (11, 41), a first plating layer (12, 42) formed at least on a region other than a region of the hermetic sealing cap member formed with a sealant (3, 32) and a second plating layer (13, 43), formed on the region of the hermetic sealing cap member on which the sealant is arranged, containing a material superior in wettability with the sealant to the first plating layer.
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