Invention Grant
- Patent Title: Circuit property measurement method
- Patent Title (中): 电路性能测量方法
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Application No.: US11055698Application Date: 2005-02-11
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Publication No.: US07173433B2Publication Date: 2007-02-06
- Inventor: Hiroyuki Hoshi , Hitoshi Kurusu
- Applicant: Hiroyuki Hoshi , Hitoshi Kurusu
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Denki Kabushiki Kaisha
- Current Assignee: Mitsubishi Denki Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2004-148309 20040518
- Main IPC: G01R35/00
- IPC: G01R35/00

Abstract:
In a high frequency circuit property measurement method, prior to property measurements of a high frequency circuit with RF measurement probe heads, RF measurement probe heads are calibrated using a calibration pattern comprising a signal line having a characteristic impedance and extending on a dielectric substrate, a first GND pad having one end disposed close to and at an interval from a first end of the signal line, a second GND pad having one end disposed close to and at an interval from a second end of the signal line, and a conductor electrically coupling the first GND pad to the second GND pad.
Public/Granted literature
- US20050258819A1 Property measurement method for high frequency circuit, calibration pattern, and calibration jig Public/Granted day:2005-11-24
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