Abstract:
In a high frequency circuit property measurement method, prior to property measurements of a high frequency circuit with RF measurement probe heads, RF measurement probe head are calibrated using a calibration pattern comprising a signal line having a characteristic impedance and extending on a dielectric substrate, a first GND pad having one end disposed close to and at an interval from a first end of the signal line, a second GND pad having one end disposed close to and at an interval from a second end of the signal line, and a conductor electrically coupling the first GNU pad to the second GND pad.
Abstract:
A field effect transistor (FET) having a stabilization circuit with a stabilization condition not affected by another circuit element, for example, a matching circuit. The stabilization circuit is pre-formed inside of the FET, thereby pre-stabilizing the FET in a frequency range in which a power amplifier is used.
Abstract:
A transistor includes: a semiconductor substrate; a first electrode on the semiconductor substrate and having first and second portions; a second electrode on the semiconductor substrate and spaced apart from the first electrode; a control electrode on the semiconductor substrate and disposed between the first electrode and the second electrode; and a first heat sink plate joined to the second portion of the first electrode without being joined to the first portion of the first electrode.
Abstract:
A directional coupler includes capacitive elements electrically connected to a coupled port and an isolated port, respectively, for a coupled line on a chip (on-chip). The capacitive elements serve as matching capacitive elements and may be MIM (Metal Insulator Metal) capacitors on a substrate. A first end of a first of the capacitive elements is connected between the coupled port and the coupled line and a second end is grounded. A first end of a second of the capacitive elements is connected between the isolated port and the coupled line and a second end is grounded.
Abstract:
A directional coupler includes capacitive elements electrically connected to a coupled port and an isolated port, respectively, for a coupled line on a chip (on-chip). The capacitive elements serve as matching capacitive elements and may be MIM (Metal Insulator Metal) capacitors on a substrate. A first end of a first of the capacitive elements is connected between the coupled port and the coupled line and a second end is grounded. A first end of a second of the capacitive elements is connected between the isolated port and the coupled line and a second end is grounded.
Abstract:
A semiconductor device with a field-effect transistor for use at a high frequency, higher than the microwave frequency band, has a pair of grounding electrodes, each having a via hole with an elliptical cross-section, the major axis of which is parallel to a direction in which source electrodes are arranged. Instead of the elliptical via hole, each grounding electrode may have via holes through which the grounding electrode is grounded.
Abstract:
A transistor includes: a semiconductor substrate; a first electrode on the semiconductor substrate and having first and second portions; a second electrode on the semiconductor substrate and spaced apart from the first electrode; a control electrode on the semiconductor substrate and disposed between the first electrode and the second electrode; and a first heat sink plate joined to the second portion of the first electrode without being joined to the first portion of the first electrode.
Abstract:
A method for inspecting a semiconductor device includes establishing a first circuit state in which electrical conduction through at least one of branch transmission line portions is established and electrical conduction through at least one other branch transmission line portion is prevented. Then, electrical signal reflection characteristics of the transmission line are measured. The method also includes establishing a second circuit state in which electrical conduction through the at least one of the branch transmission line portions is prevented and electrical conduction through the at least one other branch transmission line portions is established. Then, the electrical signal reflection characteristics of the transmission line are measured. The second circuit state is a mirror image of the first circuit state with respect to the primary transmission line. The measured values are compared.
Abstract:
A method for inspecting a semiconductor device includes establishing a first circuit state in which electrical conduction through at least one of branch transmission line portions is established and electrical conduction through at least one other branch transmission line portion is prevented. Then, electrical signal reflection characteristics of the transmission line are measured. The method also includes establishing a second circuit state in which electrical conduction through the at least one of the branch transmission line portions is prevented and electrical conduction through the at least one other branch transmission line portions is established. Then, the electrical signal reflection characteristics of the transmission line are measured. The second circuit state is a mirror image of the first circuit state with respect to the primary transmission line. The measured values are compared.
Abstract:
In a high frequency circuit property measurement method prior to property measurements of a high frequency circuit with RF measurement probe heads, RF measurement probe heads are calibrated using a calibration pattern comprising a signal line having a characteristic impedance and extending on a dielectric substrate, a first GND pad having one end disposed close to and at an interval from a first end of the signal line, a second GND pad having one end disposed close to and at an interval from a second end of the signal line, and a conductor electrically coupling the first GND pad to the second GND pad.