Invention Grant
- Patent Title: High voltage MOSFET having doped buried layer
- Patent Title (中): 具有掺杂埋层的高压MOSFET
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Application No.: US10860295Application Date: 2004-06-03
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Publication No.: US07176538B2Publication Date: 2007-02-13
- Inventor: Sun-hak Lee , Kwang-dong Yoo
- Applicant: Sun-hak Lee , Kwang-dong Yoo
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec PA
- Priority: KR10-2003-0040182 20030620
- Main IPC: H01L29/772
- IPC: H01L29/772

Abstract:
A MOSFET includes an insulated gate electrode on a surface of a semiconductor substrate having an impurity region of first conductivity type therein that extends to the surface. Source and drain regions of second conductivity type are provided in the impurity region. The source region includes a highly doped source contract region that extends to the surface and a lightly doped source extension. The lightly doped source extension extends laterally underneath a first end of the insulated gate electrode and defines a source-side P-N junction with the well region. The drain region includes a highly doped drain contact region that extends to the surface and a lightly doped drain extension. The lightly doped drain extension extends laterally underneath a second end of the insulated gate electrode and defines a drain-side P-N junction with the well region. This well region, which extends within the impurity region and defines a non-rectifying junction therewith, is more highly doped than the impurity region. The well region extends opposite the insulated gate electrode and has a sufficient width that dopants therein partially compensate innermost portions of the lightly doped source and drain extensions that extend underneath the insulated gate electrode. However, the well region is not so wide as to provide compensation to remaining portions of the lightly doped source and drain extensions or the source and drain contact regions.
Public/Granted literature
- US20040256646A1 High voltage MOSFET and method of fabricating the same Public/Granted day:2004-12-23
Information query
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