- 专利标题： Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material
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申请号： US11099907申请日： 2005-04-05
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公开(公告)号： US07179684B2公开(公告)日： 2007-02-20
- 发明人: Song-Hua Shi , Lejun Wang , Tian-An Chen
- 申请人： Song-Hua Shi , Lejun Wang , Tian-An Chen
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/58
摘要：
Microelectronic and optoelectronic packaging embodiments are described with underfill materials including polybenzoxazine, having the general formula:
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