A manufacturing method for manufacturing ceramic electronic components, includes steps of forming a stack body by stacking ceramic green sheets and conductive layers on top of each other, punching a frame into the stack body and holding the frame in the stack body, locating a pressing force applying member inside the frame and, while the frame is held in the stack body, applying a pressing force to a portion of the stack body located inside the frame by causing the pressing force applying member located inside the frame to press against the portion of the stack body located inside the frame, to thereby form a high-density structure inside the frame while preventing the high-density structure from deforming outwardly beyond the frame. The stack body can be heated to reduce the required pressing force, and an elastic member may be provided to make the pressing force uniform.