公开(公告)号：US07182899B2

公开(公告)日：2007-02-27

申请号：US10433943

申请日：2002-09-18

申请人： Shin Tanii ,  Yoshiya Sakaguchi ,  Mitsuhiro Yamazaki ,  Toru Kitamachi

发明人： Shin Tanii ,  Yoshiya Sakaguchi ,  Mitsuhiro Yamazaki ,  Toru Kitamachi

IPC分类号： H01G4/30 ,  B29C43/30

CPC分类号： H01G4/30 ,  Y10T83/2042 ,  Y10T156/107 ,  Y10T156/1075

摘要： A manufacturing method for manufacturing ceramic electronic components, includes steps of forming a stack body by stacking ceramic green sheets and conductive layers on top of each other, punching a frame into the stack body and holding the frame in the stack body, locating a pressing force applying member inside the frame and, while the frame is held in the stack body, applying a pressing force to a portion of the stack body located inside the frame by causing the pressing force applying member located inside the frame to press against the portion of the stack body located inside the frame, to thereby form a high-density structure inside the frame while preventing the high-density structure from deforming outwardly beyond the frame. The stack body can be heated to reduce the required pressing force, and an elastic member may be provided to make the pressing force uniform.

摘要翻译： 一种制造陶瓷电子部件的制造方法，其特征在于，包括以下步骤：将陶瓷生片和导电层叠置在一起而形成叠层体，将框架冲压成堆叠体，将框架保持在堆叠体内， 施加构件在框架内部，并且当框架被保持在堆叠体中时，通过使位于框架内部的按压力施加构件压靠在框架内部的部分上而对位于框架内部的堆叠体的一部分施加按压力 堆叠体位于框架内部，从而在框架内形成高密度结构，同时防止高密度结构向外变形超出框架。 可以加热堆体以减少所需的按压力，并且可以设置弹性构件以使按压力均匀。