Invention Grant
- Patent Title: Ultrathin leadframe BGA circuit package
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Application No.: US10931363Application Date: 2004-08-31
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Publication No.: US07183134B2Publication Date: 2007-02-27
- Inventor: Teck Kheng Lee , Tan Yong Kian , Setho Sing Fee
- Applicant: Teck Kheng Lee , Tan Yong Kian , Setho Sing Fee
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman, Lundberg, Woessner & Kluth, P.A.
- Priority: SG200202330-7 20020419
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A circuit package is formed using a leadframe. The leadframe is formed or etched to align a plurality of bond pad structures above a reference plane while supporting leadframe fingers are positioned below the reference plane. Jumper wires are wirebonded between terminals on the die and the bond pads to form a package subassembly. The subassembly is encapsulated and then background to remove the leadframe fingers and surrounding frame. The bond pads which remain embedded in the encapsulation material are exposed on the lower surface of the package for connection to further conductors.
Public/Granted literature
- US20050026386A1 Ultrathin leadframe BGA circuit package Public/Granted day:2005-02-03
Information query
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