发明授权
- 专利标题： Headphone
- 专利标题（中）： 耳机
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申请号： US10528696申请日： 2004-08-11
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公开(公告)号： US07184565B2公开(公告)日： 2007-02-27
- 发明人: Takashi Ohta
- 申请人： Takashi Ohta
- 申请人地址： JP Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权： JP2003-293078 20030813
- 国际申请： PCT/JP2004/011808 WO 20040811
- 国际公布： WO2005/018276 WO 20050224
- 主分类号： H04R25/00
- IPC分类号： H04R25/00
摘要：
In order to provide headphones with a cord-winding mechanism capable of favorably retracting and winding a cord, a cord-winding mechanism is incorporated in either or both of the casings of housings 1L and 1R constituting headphones; and a lock is released by joining the left and right casings together, so that the cord is retracted and wound.
公开/授权文献
- US20060013429A1 Headphone 公开/授权日：2006-01-19
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