发明授权
- 专利标题： Fiber embedded polishing pad
- 专利标题（中）： 光纤嵌入式抛光垫
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申请号： US11271744申请日： 2005-11-14
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公开(公告)号： US07186166B2公开(公告)日： 2007-03-06
- 发明人: Shyng-Tsong Chen , Kenneth Davis , Oscar Kai Chi Hsu , Kenneth Rodbell , Jean Vangsness
- 申请人： Shyng-Tsong Chen , Kenneth Davis , Oscar Kai Chi Hsu , Kenneth Rodbell , Jean Vangsness
- 申请人地址： US NY Armonk US MA Lowell
- 专利权人： International Business Machines Corporation,Freudenberg Nonwovens Ltd.
- 当前专利权人： International Business Machines Corporation,Freudenberg Nonwovens Ltd.
- 当前专利权人地址： US NY Armonk US MA Lowell
- 代理机构： Connolly Bove Lodge & Hutz LLP
- 代理商 Robert M. Trepp, Esq.
- 主分类号： B24B1/00
- IPC分类号： B24B1/00
摘要：
A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The loose fibers define and the precursors were mixed first with curatives, then mold into a pad form. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers.
公开/授权文献
- US20060116059A1 Fiber embedded polishing pad 公开/授权日：2006-06-01
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