Invention Grant
US07186324B2 Hard film cutting tools, cutting tool coated with hard film, process for forming hard film and target used to form hard film
有权
硬膜切割工具,涂有硬膜的切割工具,形成硬膜的工艺和用于形成硬膜的目标
- Patent Title: Hard film cutting tools, cutting tool coated with hard film, process for forming hard film and target used to form hard film
- Patent Title (中): 硬膜切割工具,涂有硬膜的切割工具,形成硬膜的工艺和用于形成硬膜的目标
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Application No.: US11109726Application Date: 2005-04-20
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Publication No.: US07186324B2Publication Date: 2007-03-06
- Inventor: Kenji Yamamoto , Toshiki Satou , Yasuomi Morikawa , Koji Hanaguri , Kazuki Takahara
- Applicant: Kenji Yamamoto , Toshiki Satou , Yasuomi Morikawa , Koji Hanaguri , Kazuki Takahara
- Applicant Address: JP Kobe
- Assignee: Kabushiki Kaisha Kobe Seiko Sho
- Current Assignee: Kabushiki Kaisha Kobe Seiko Sho
- Current Assignee Address: JP Kobe
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- Priority: JP2000-402555 20001228; JP2001-185464 20010619; JP2001-185465 20010619; JP2001-287587 20010920; JP2001-310562 20011005
- Main IPC: C23C14/00
- IPC: C23C14/00

Abstract:
A hard film for cutting tools which is composed of (Ti1−a−b−c−d, Ala, Crb, Sic, Bd)(C1−eNe) 0.5≦a≦0.8, 0.06≦b, 0≦c≦0.1, 0≦d≦0.1, 0≦c+d≦0.1, a+b+c+d
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