Invention Grant
- Patent Title: Methods to improve photonic performances of photo-sensitive integrated circuits
- Patent Title (中): 提高光敏集成电路光子性能的方法
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Application No.: US10906604Application Date: 2005-02-25
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Publication No.: US07189957B2Publication Date: 2007-03-13
- Inventor: Shih-Chi Fu , Yuan-Hung Liu , Kuo-Yin Lin , Feng-Jia Shiu , Chia-Shiung Tsai , Ching-Sen Kuo , Jieh-Jang Chen
- Applicant: Shih-Chi Fu , Yuan-Hung Liu , Kuo-Yin Lin , Feng-Jia Shiu , Chia-Shiung Tsai , Ching-Sen Kuo , Jieh-Jang Chen
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Baker & McKenzie LLP
- Main IPC: H01L31/00
- IPC: H01L31/00 ; H01L21/00

Abstract:
Described is a light-directing feature formed in the inter-level dielectric (ILD) layer in combination with an anti-reflective (AR) layer to effectively and simultaneously increase quantum efficiency and cross-talk immunity thereby improving photonic performances of photo-sensitive integrated circuits. A plurality of photosensor cells is formed on a semiconductor substrate. An AR layer is subsequently formed on the plurality of photosensor cells, the AR layer being substantially non-reflective of incident light. An ILD layer is then formed over the AR layer, the ILD layer comprising a plurality of light-directing features formed in openings in the ILD layer over the AR layer above and about certain of the plurality of photosensor cells.
Public/Granted literature
- US20060192083A1 Methods to Improve Photonic Performances of Photo-Sensitive Integrated Circuits Public/Granted day:2006-08-31
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