Electronic devices comprising conductive members that connect electrodes to other conductive members within a substrate and processes for forming the electronic devices

Invention Grant

US07189991B2 Electronic devices comprising conductive members that connect electrodes to other conductive members within a substrate and processes for forming the electronic devices 有权

Title translation: 电子设备包括将电极连接到衬底内的其它导电构件并且用于形成电子器件的导电构件

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Patent Title: Electronic devices comprising conductive members that connect electrodes to other conductive members within a substrate and processes for forming the electronic devices
Patent Title (中): 电子设备包括将电极连接到衬底内的其它导电构件并且用于形成电子器件的导电构件
Application No.: US11025110

Application Date: 2004-12-29
Publication No.: US07189991B2

Publication Date: 2007-03-13
Inventor: Gang Yu , Shiva Prakash
Applicant: Gang Yu , Shiva Prakash
Applicant Address: US DE Wilmington
Assignee: E. I. du Pont de Nemours and Company
Current Assignee: E. I. du Pont de Nemours and Company
Current Assignee Address: US DE Wilmington
Agent John H. Lamming
Main IPC: H01L29/08
IPC: H01L29/08 ; H01L35/24 ; H01L51/00

Electronic devices comprising conductive members that connect electrodes to other conductive members within a substrate and processes for forming the electronic devices

Abstract:

An electronic device includes a substrate including a pixel driving circuit, a first conductive member, and a second conductive member. The first and second conductive members are spaced apart, the first conductive member is connected to the pixel driving circuit, and the second conductive member can be part of a power transmission line. The electronic device also includes an electronic component that includes a first electrode that contacts the first conductive member, a second electrode that is connected to but does not contact the second conductive member, and an organic layer lying between the first and second electrodes. The electronic device also includes a third conductive member that is connected to the second electrode and the second conductive member, and contacts the second conductive member. In one embodiment, a process for forming the electronic device uses the second electrode as a hardmask when removing portions of the first organic layer.

Abstract(Chinese):

电子装置包括：基板，包括像素驱动电路，第一导电部件和第二导电部件。第一和第二导电构件间隔开，第一导电构件连接到像素驱动电路，并且第二导电构件可以是输电线路的一部分。电子设备还包括电子部件，其包括接触第一导电部件的第一电极，与第二导电部件连接但不与第二导电部件接触的第二电极以及位于第一和第二电极之间的有机层。电子设备还包括连接到第二电极和第二导电构件并与第二导电构件接触的第三导电构件。在一个实施例中，当去除第一有机层的部分时，用于形成电子器件的工艺使用第二电极作为硬掩模。

Public/Granted literature

US20060138401A1 Electronic devices comprising conductive members that connect electrodes to other conductive members within a substrate and processes for forming the electronic devices Public/Granted day:2006-06-29

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L29/00	专门适用于整流、放大、振荡或切换，并具有至少一个电位跃变势垒或表面势垒的半导体器件；具有至少一个电位跃变势垒或表面势垒，例如PN结耗尽层或载流子集结层的电容器或电阻器；半导体本体或其电极的零部件（H01L31/00至H01L47/00，H01L51/05优先；除半导体或其电极之外的零部件入H01L23/00；由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00）
H01L29/02	.按其半导体本体的特征区分的
H01L29/06	..按其形状区分的；按各半导体区域的形状、相对尺寸或配置区分的
H01L29/08	...具有连接到1个通有待整流、放大或切换的电流的电极上去的半导体区域的；并且这样的电极又是包含3个或更多个电极的半导体器件的组成部分的