Invention Grant
- Patent Title: Thermal micro-valves for micro-integrated devices
- Patent Title (中): 用于微型集成器件的热敏微型阀
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Application No.: US10696889Application Date: 2003-10-30
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Publication No.: US07195036B2Publication Date: 2007-03-27
- Inventor: Mark A. Burns , Rohit Pal
- Applicant: Mark A. Burns , Rohit Pal
- Applicant Address: US MI Ann Arbor
- Assignee: The Regents of the University of Michigan
- Current Assignee: The Regents of the University of Michigan
- Current Assignee Address: US MI Ann Arbor
- Agency: Medlen & Carroll, LLP
- Main IPC: F15C1/04
- IPC: F15C1/04 ; F16K13/10

Abstract:
The movement and mixing of microdroplets through microchannels is described employing silicon-based microscale devices, comprising microdroplet transport channels, reaction regions, electrophoresis modules, and radiation detectors. The discrete droplets are differentially heated and propelled through etched channels. Electronic components are fabricated on the same substrate material, allowing sensors and controlling circuitry to be incorporated in the same device.
Public/Granted literature
- US20040219732A1 Thermal micro-valves for micro-integrated devices Public/Granted day:2004-11-04
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