发明授权
- 专利标题： Interconnect structure having multiple layers of traces for electrical connection to a tape head assembly
- 专利标题（中）： 具有用于电连接到磁带头组件的多层迹线的互连结构
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申请号： US10737938申请日： 2003-12-17
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公开(公告)号： US07196866B2公开(公告)日： 2007-03-27
- 发明人: Paul W. Poorman , Ralph F. Simmons, Jr. , Lawrence A. Hansen
- 申请人： Paul W. Poorman , Ralph F. Simmons, Jr. , Lawrence A. Hansen
- 申请人地址： US TX Houston
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Houston
- 主分类号： G11B5/008
- IPC分类号： G11B5/008
摘要：
An apparatus and method for electrically coupling read elements and write elements of a tape head assembly to another component includes an interconnect structure having plural layers of traces, with the traces comprising write traces electrically connected to respective write elements, and read traces electrically connected to respective read elements. The write traces and read traces are interleaved across a dimension of the interconnect structure.
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