Invention Grant
- Patent Title: Thin film capacitor, high-density packaging substrate incorporating thin film capacitor, and method for manufacturing thin-film capacitor
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Application No.: US10974789Application Date: 2004-10-28
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Publication No.: US07196898B2Publication Date: 2007-03-27
- Inventor: Tetsuya Osaka , Ichiro Koiwa , Akira Hashimoto , Yoshimi Sato
- Applicant: Tetsuya Osaka , Ichiro Koiwa , Akira Hashimoto , Yoshimi Sato
- Applicant Address: JP Tokyo JP Tokyo JP Kanagawa
- Assignee: Waseda University,Oki Electric Industry Co., Ltd.,Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Waseda University,Oki Electric Industry Co., Ltd.,Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Tokyo JP Tokyo JP Kanagawa
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2003-373495 20031031; JP2004-052400 20040226
- Main IPC: H01G4/06
- IPC: H01G4/06
Abstract:
A capacitor capable of being incorporated into a packaging substrate, which capacitor includes a high-dielectric-constant layer, and an upper electrode layer and a lower electrode layer sandwiching the high-dielectric-constant layer from the upper side and the lower side. A packaging substrate containing the capacitor, and a method for producing the same are also provided.
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