This invention is directed to reduce degradation, loss, and reflection of high frequency signals of a coupling circuit for an alternating current. The coupling circuit, for connecting a first circuit element to a second circuit element, comprises a die capacitor and a chip capacitor connected in parallel to each other. The die capacitor has a first electrode that faces to and is in contact with the first circuit element, and a second electrode that is wire-bonded to the second circuit element. The chip capacitor also has a first electrode that is in contact with the first circuit element and a second electrode that is in contact with the second electrode of the die capacitor. The coupling circuit may show both advantages of superior performance at high frequencies attributed to the die-capacitor and relative large capacitance attributed to the chip-capacitor.