发明授权
- 专利标题： Polishing apparatus and method with direct load platen
- 专利标题（中）： 抛光装置和方法与直接负载压板
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申请号： US11241254申请日： 2005-09-30
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公开(公告)号： US07198548B1公开(公告)日： 2007-04-03
- 发明人: Hung Chih Chen
- 申请人： Hung Chih Chen
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Fish & Richardson
- 主分类号： B24B49/00
- IPC分类号： B24B49/00
摘要：
A method and apparatus for chemical mechanical polishing includes a platen supports a polishing article, a robot located proximate the platen, a carrier head having a retaining ring, and a carrier heads support mechanism. The robot is configured to position a substrate on the polishing article, and the carrier heads support mechanism is configured to move the carrier head into a position that the retaining ring surrounds the substrate.
公开/授权文献
- US20070077861A1 POLISHING APPARATUS AND METHOD WITH DIRECT LOAD PLATEN 公开/授权日：2007-04-05
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