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US07198548B1 Polishing apparatus and method with direct load platen 失效
抛光装置和方法与直接负载压板

Polishing apparatus and method with direct load platen
摘要:
A method and apparatus for chemical mechanical polishing includes a platen supports a polishing article, a robot located proximate the platen, a carrier head having a retaining ring, and a carrier heads support mechanism. The robot is configured to position a substrate on the polishing article, and the carrier heads support mechanism is configured to move the carrier head into a position that the retaining ring surrounds the substrate.
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