Invention Grant
- Patent Title: Method of manufacturing semiconductor device
- Patent Title (中): 制造半导体器件的方法
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Application No.: US10446078Application Date: 2003-05-28
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Publication No.: US07199030B2Publication Date: 2007-04-03
- Inventor: Satoshi Ikeda , Yutaka Kamata , Ikuo Kurachi , Norio Hirashita
- Applicant: Satoshi Ikeda , Yutaka Kamata , Ikuo Kurachi , Norio Hirashita
- Applicant Address: JP Tokyo
- Assignee: Oki Electric Industry Co., Ltd.
- Current Assignee: Oki Electric Industry Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Rabin & Berdo, PC
- Priority: JP2002-293542 20021007
- Main IPC: H01L21/425
- IPC: H01L21/425 ; H01L21/265

Abstract:
An impurity is ion-implanted with a silicon nitride film formed on a silicon substrate as a mask film to form a source/drain layer of a MOS transistor. Heat treatment for activating the impurity is done as it is without removing the silicon nitride film to thereby produce heat treatment-based stress between the silicon nitride film and the silicon substrate.
Public/Granted literature
- US20040067626A1 Method of manufacturing semiconductor device Public/Granted day:2004-04-08
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