Invention Grant
- Patent Title: Method and structure for manufacturing improved yield semiconductor packaged devices
- Patent Title (中): 制造改进产量半导体封装器件的方法和结构
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Application No.: US11146889Application Date: 2005-06-06
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Publication No.: US07199463B2Publication Date: 2007-04-03
- Inventor: Tongbi Jiang
- Applicant: Tongbi Jiang
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Dorsey & Whitney, LLP
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/053
Abstract:
A semiconductor package structure for a ball grid array type package using a plurality of pieces of adhesive elastomer film to attach a semiconductor die to a substrate having conductive traces in order to alleviate thermal mismatch stress between the semiconductor die and the printed circuit board to which the packaged device is soldered, while maintaining the reliability of the packaged device itself.
Public/Granted literature
- US20050285279A1 Method and structure for manufacturing improved yield semiconductor packaged devices Public/Granted day:2005-12-29
Information query
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