Invention Grant
- Patent Title: Method of separating layers of material
-
Application No.: US11008589Application Date: 2004-12-09
-
Publication No.: US07202141B2Publication Date: 2007-04-10
- Inventor: Jongkook Park , Jeffrey P. Sercel , Patrick J. Sercel
- Applicant: Jongkook Park , Jeffrey P. Sercel , Patrick J. Sercel
- Applicant Address: US NH Manchester
- Assignee: J.P. Sercel Associates, Inc.
- Current Assignee: J.P. Sercel Associates, Inc.
- Current Assignee Address: US NH Manchester
- Agency: Grossman Tucker Perreault & Pfleger, PLLC
- Main IPC: H01L29/22
- IPC: H01L29/22 ; H01L21/30 ; H01L21/46
Abstract:
A lift off process is used to separate a layer of material from a substrate by irradiating an interface between the layer of material and the substrate. According to one exemplary process, the layer is separated into a plurality of sections corresponding to dies on the substrate and a homogeneous beam spot is shaped to cover an integer number of the sections.
Public/Granted literature
- US20050227455A1 Method of separating layers of material Public/Granted day:2005-10-13
Information query
IPC分类:
