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发明授权
US07202553B2 Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging 有权
使用反应箔的晶圆接合用于大规模并行微机电系统封装

Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging
摘要：
A method for forming device packages includes forming a perimeter with a reactive foil and a bonding material interposed between a first wafer and a second wafer, pressing the first and the second wafers against the reactive foil and the bonding material, initiating the reactive foil, wherein the reactive foil heats the bonding material to create a bond between the first and the second wafers, and singulating the first and the second wafers into the device packages.
摘要（中）：

一种用于形成器件封装的方法包括用反应箔形成周边，以及插入在第一晶片和第二晶片之间的接合材料，将第一和第二晶片压在反应箔和接合材料上，引发反应箔，其中 反应箔加热接合材料以在第一和第二晶片之间形成结合，并且将第一和第二晶片分离成器件封装。

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