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1.发明授权Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging 有权使用反应箔的晶圆接合用于大规模并行微机电系统封装公开(公告)号：US07202553B2
公开(公告)日：2007-04-10
申请号：US10826800
申请日：2004-04-15
IPC分类号： H01L23/02
CPC分类号： B81C1/00269 , B81C2203/0118 , B81C2203/019 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A method for forming device packages includes forming a perimeter with a reactive foil and a bonding material interposed between a first wafer and a second wafer, pressing the first and the second wafers against the reactive foil and the bonding material, initiating the reactive foil, wherein the reactive foil heats the bonding material to create a bond between the first and the second wafers, and singulating the first and the second wafers into the device packages.
摘要翻译： 一种用于形成器件封装的方法包括用反应箔形成周边，以及插入在第一晶片和第二晶片之间的接合材料，将第一和第二晶片压在反应箔和接合材料上，引发反应箔，其中 反应箔加热接合材料以在第一和第二晶片之间形成结合，并且将第一和第二晶片分离成器件封装。
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2.发明申请公开(公告)号：US20120327752A1
公开(公告)日：2012-12-27
申请号：US13167054
申请日：2011-06-23
申请人： Tanya Jegeris Snyder
发明人： Tanya Jegeris Snyder
CPC分类号： G11B5/314 , B82Y20/00 , G02B6/1226 , G02B6/4206 , G02B6/4214 , G11B5/105 , G11B5/6088 , G11B2005/0021 , Y10T156/10
摘要： An apparatus includes a transducer assembly including a waveguide and a grating structured to couple electromagnetic radiation into the waveguide, and a laser module including a laser diode and a transparent cover adjacent to an output facet of the laser diode, wherein the laser module is bonded to the transducer assembly and the laser diode directs electromagnetic radiation through the transparent cover and onto the grating. A method of making the apparatus is also provided.
摘要翻译： 一种设备包括：换能器组件，其包括波导和被构造为将电磁辐射耦合到波导中的光栅;以及激光模块，包括激光二极管和与激光二极管的输出端相邻的透明盖，其中激光模块结合到 换能器组件和激光二极管将电磁辐射通过透明盖引导到光栅上。 还提供了制造该装置的方法。
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公开(公告)号：US08254212B2
公开(公告)日：2012-08-28
申请号：US12491914
申请日：2009-06-25
IPC分类号： G11B11/00
CPC分类号： G11B5/314 , G11B5/102 , G11B5/3173 , G11B5/6088 , G11B7/1387 , G11B2005/0005 , G11B2005/0021
摘要： An integrated heat-assisted magnetic recording (HAMR) device comprises a slider that has a top surface, a bottom surface, and a trailing end. A waveguide is carried on the trailing end and a near field transducer is positioned to receive energy from the waveguide and produce plasmons for heating a region of a magnetic medium. A write pole is carried by the slider adjacent to the near field transducer. A laser is mounted on the top surface of the slider and produces a laser beam that passes through a beam shaper mounted on the top surface of the slider that collimates or focuses the laser beam. A mirror is mounted on the slider for directing the collimated or focused light beam into the waveguide.
摘要翻译： 集成的热辅助磁记录（HAMR）装置包括具有顶表面，底表面和后端的滑块。 在后端承载波导，并且定位近场换能器以从波导接收能量并产生用于加热磁介质区域的等离子体激元。 一个写极柱由靠近近场传感器的滑块承载。 激光器安装在滑块的顶表面上，并产生穿过安装在滑块的顶表面上的光束整形器的激光束，该激光束使激光束准直或聚焦。 在滑块上安装有反射镜，用于将准直或聚焦的光束引导到波导中。
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公开(公告)号：US20100328807A1
公开(公告)日：2010-12-30
申请号：US12491914
申请日：2009-06-25
IPC分类号： G11B5/02
CPC分类号： G11B5/314 , G11B5/102 , G11B5/3173 , G11B5/6088 , G11B7/1387 , G11B2005/0005 , G11B2005/0021
摘要： An integrated heat-assisted magnetic recording (HAMR) device comprises a slider that has a top surface, a bottom surface, and a trailing end. A waveguide is carried on the trailing end and a near field transducer is positioned to receive energy from the waveguide and produce plasmons for heating a region of a magnetic medium. A write pole is carried by the slider adjacent to the near field transducer. A laser is mounted on the top surface of the slider and produces a laser beam that passes through a beam shaper mounted on the top surface of the slider that collimates or focuses the laser beam. A mirror is mounted on the slider for directing the collimated or focused light beam into the waveguide.
摘要翻译： 集成的热辅助磁记录（HAMR）装置包括具有顶表面，底表面和后端的滑块。 在后端承载波导，并且定位近场换能器以从波导接收能量并产生用于加热磁介质区域的等离子体激元。 一个写极柱由靠近近场传感器的滑块承载。 激光器安装在滑块的顶表面上，并产生穿过安装在滑块的顶表面上的光束整形器的激光束，该激光束使激光束准直或聚焦。 在滑块上安装有反射镜，用于将准直或聚焦的光束引导到波导中。
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5.发明授权Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging 有权使用反应箔的晶圆接合用于大规模并行微机电系统封装公开(公告)号：US07176106B2
公开(公告)日：2007-02-13
申请号：US10461291
申请日：2003-06-13
CPC分类号： B81C1/00269 , B81C2203/0118 , B81C2203/019 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A method for forming device packages includes forming a perimeter comprising a reactive foil and a bonding material interposed between a first wafer and a second wafer, pressing the first and the second wafers against the reactive foil and the bonding material, initiating the reactive foil, wherein the reactive foil heating the bonding material to create a bond between the first and the second wafers, and singulating the first and the second wafers into the device packages.
摘要翻译： 一种用于形成器件封装的方法包括形成包括反应箔和插入在第一晶片和第二晶片之间的接合材料的周边，将第一和第二晶片压在反应箔和接合材料上，引发反应箔，其中 所述反应箔加热所述接合材料以在所述第一和第二晶片之间形成结合，以及将所述第一和第二晶片分离成所述器件封装。
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公开(公告)号：US08532157B2
公开(公告)日：2013-09-10
申请号：US13031667
申请日：2011-02-22
申请人： Douglas Cole , Lijuan Zhong , Roger Lee Hipwell, Jr. , Joseph Michael Stephan , Scott Eugene Olson , Tanya Jegeris Snyder , Yongjun Zhao
发明人： Douglas Cole , Lijuan Zhong , Roger Lee Hipwell, Jr. , Joseph Michael Stephan , Scott Eugene Olson , Tanya Jegeris Snyder , Yongjun Zhao
IPC分类号： H01S3/08
CPC分类号： G11B5/4866 , G02B6/12004 , G11B5/105 , G11B2005/0021 , H01L2224/16225 , H01L2224/73253 , H01S5/02208 , H01S5/02228 , H01S5/02252 , H01S5/02256 , H01S5/02268 , H01S5/02272
摘要： A method includes: positioning a laser in the cavity in an end of a slider, wherein the laser has an output facet positioned adjacent to a first wall of the cavity to define a first gap between the output facet and the first wall of the cavity, and filling at least a portion of the first gap adjacent to the output facet. An apparatus including a slider including a cavity in a trailing end of the slider, a laser positioned in the cavity and having an output facet positioned adjacent to a first wall of the cavity to define a first gap between the output facet and the first wall of the cavity, and a sealing material filling at least a portion of the first gap adjacent to the output facet is also provided.
摘要翻译： 一种方法包括：将激光器定位在滑块的端部中的空腔中，其中激光器具有邻近腔的第一壁定位的输出小面，以在输出小平面和空腔的第一壁之间限定第一间隙， 以及填充与所述输出小面相邻的所述第一间隙的至少一部分。 一种包括滑块的装置，包括在滑块的后端中的空腔，位于空腔中的激光器，具有邻近腔体的第一壁定位的输出小面，以在输出小面和第一壁之间形成第一间隙 空腔和填充与输出小面相邻的第一间隙的至少一部分的密封材料。
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7.发明授权公开(公告)号：US08488435B2
公开(公告)日：2013-07-16
申请号：US13167054
申请日：2011-06-23
申请人： Tanya Jegeris Snyder
发明人： Tanya Jegeris Snyder
IPC分类号： G11B7/00
CPC分类号： G11B5/314 , B82Y20/00 , G02B6/1226 , G02B6/4206 , G02B6/4214 , G11B5/105 , G11B5/6088 , G11B2005/0021 , Y10T156/10
摘要： An apparatus includes a transducer assembly including a waveguide and a grating structured to couple electromagnetic radiation into the waveguide, and a laser module including a laser diode and a transparent cover adjacent to an output facet of the laser diode, wherein the laser module is bonded to the transducer assembly and the laser diode directs electromagnetic radiation through the transparent cover and onto the grating. A method of making the apparatus is also provided.
摘要翻译： 一种设备包括：换能器组件，其包括波导和被构造为将电磁辐射耦合到波导中的光栅;以及激光模块，包括激光二极管和与激光二极管的输出端相邻的透明盖，其中激光模块结合到 换能器组件和激光二极管将电磁辐射通过透明盖引导到光栅上。 还提供了制造该装置的方法。
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公开(公告)号：US20120044967A1
公开(公告)日：2012-02-23
申请号：US13031667
申请日：2011-02-22
申请人： Douglas Cole , Lijuan Zhong , Roger Lee Hipwell, JR. , Joseph Michael Stephan , Scott Eugene Olson , Tanya Jegeris Snyder , Yongjun Zhao
发明人： Douglas Cole , Lijuan Zhong , Roger Lee Hipwell, JR. , Joseph Michael Stephan , Scott Eugene Olson , Tanya Jegeris Snyder , Yongjun Zhao
IPC分类号： H01S3/08
CPC分类号： G11B5/4866 , G02B6/12004 , G11B5/105 , G11B2005/0021 , H01L2224/16225 , H01L2224/73253 , H01S5/02208 , H01S5/02228 , H01S5/02252 , H01S5/02256 , H01S5/02268 , H01S5/02272
摘要： A method includes: positioning a laser in the cavity in an end of a slider, wherein the laser has an output facet positioned adjacent to a first wall of the cavity to define a first gap between the output facet and the first wall of the cavity, and filling at least a portion of the first gap adjacent to the output facet. An apparatus including a slider including a cavity in a trailing end of the slider, a laser positioned in the cavity and having an output facet positioned adjacent to a first wall of the cavity to define a first gap between the output facet and the first wall of the cavity, and a sealing material filling at least a portion of the first gap adjacent to the output facet is also provided.
摘要翻译： 一种方法包括：将激光器定位在滑块的端部中的空腔中，其中激光器具有邻近腔的第一壁定位的输出小面，以在输出小平面和空腔的第一壁之间限定第一间隙， 以及填充与所述输出小面相邻的所述第一间隙的至少一部分。 一种包括滑块的装置，包括在滑块的后端中的空腔，位于空腔中的激光器，具有邻近腔体的第一壁定位的输出小面，以在输出小面和第一壁之间形成第一间隙 空腔和填充与输出小面相邻的第一间隙的至少一部分的密封材料。
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公开(公告)号：US07422929B2
公开(公告)日：2008-09-09
申请号：US11071550
申请日：2005-03-02
申请人： Kendra J. Gallup , Frank S. Geefay , Ronald Shane Fazzio , Martha Johnson , Carrie Ann Guthrie , Tanya Jegeris Snyder , Richard C. Ruby
发明人： Kendra J. Gallup , Frank S. Geefay , Ronald Shane Fazzio , Martha Johnson , Carrie Ann Guthrie , Tanya Jegeris Snyder , Richard C. Ruby
CPC分类号： H01S5/02288 , G02B6/4206 , H01L2924/0002 , H01S5/02248 , H01S5/02292 , H01L2924/00
摘要： In an embodiment, the invention provides a method for forming a wafer-level package. A bonding pad is formed on a first wafer. After forming the bonding pad, an optoelectronic device is located on the first wafer. A gasket is formed on a second wafer. After a gasket is formed on a second wafer, the second wafer is attached to the first wafer with a bond between the gasket and the bonding pad.
摘要翻译： 在一个实施例中，本发明提供了一种用于形成晶片级封装的方法。 在第一晶片上形成接合焊盘。 在形成接合焊盘之后，光电子器件位于第一晶片上。 在第二晶片上形成垫圈。 在第二晶片上形成垫圈之后，第二晶片通过垫片和焊盘之间的接合附接到第一晶片。
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公开(公告)号：US06953990B2
公开(公告)日：2005-10-11
申请号：US10666363
申请日：2003-09-19
申请人： Kendra J. Gallup , Frank S. Geefay , Ronald Shane Fazzio , Martha Johnson , Carrie Ann Guthrie , Tanya Jegeris Snyder , Richard C. Ruby
发明人： Kendra J. Gallup , Frank S. Geefay , Ronald Shane Fazzio , Martha Johnson , Carrie Ann Guthrie , Tanya Jegeris Snyder , Richard C. Ruby
IPC分类号： H01L23/02 , B81B7/00 , B81C3/00 , G02B6/42 , H01L21/00 , H01L21/46 , H01L21/60 , H01L23/495 , H01L31/0203 , H01L31/0232 , H01L33/00 , H01S5/00 , H01S5/02 , H01S5/022 , H01S5/026
CPC分类号： H01S5/02288 , G02B6/4206 , H01L2924/0002 , H01S5/02248 , H01S5/02292 , H01L2924/00
摘要： A wafer-level package includes a first wafer comprising a bonding pad, an optoelectronic device on the first wafer, and a second wafer comprising a gasket. The second wafer is attached to the first wafer by a bond between the gasket and the bonding pad.
摘要翻译： 晶片级封装包括第一晶片，其包括接合焊盘，第一晶片上的光电器件，以及包括垫片的第二晶片。 第二晶片通过垫圈和接合垫之间的接合附接到第一晶片。
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