Invention Grant
- Patent Title: Automatic N2 purge system for 300 mm full automation fab
- Patent Title (中): 自动N2吹扫系统，适用于300 mm全自动化工厂
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Application No.: US10821156Application Date: 2004-04-08
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Publication No.: US07203563B2Publication Date: 2007-04-10
- Inventor: Ko-Pin Chang , Jui-An Shih , Hui-Tang Liu , Simon Chang , Nain-Sung Lee , Yung-Chang Peng
- Applicant: Ko-Pin Chang , Jui-An Shih , Hui-Tang Liu , Simon Chang , Nain-Sung Lee , Yung-Chang Peng
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G06F19/00
- IPC: G06F19/00
Abstract:
A system for manufacturing semiconductor integrated circuit (IC) devices, including an operating control system, a process intermediate station in communication with the operating control system, and a gas purge device, wherein the gas purge device is included in the process intermediate station.
Public/Granted literature
- US20050228530A1 Automatic N2 purge system for 300mm full automation fab Public/Granted day:2005-10-13
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