Invention Grant
- Patent Title: Semiconductor substrate damage protection system
- Patent Title (中): 半导体衬底损坏保护系统
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Application No.: US10198688Application Date: 2002-07-17
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Publication No.: US07204669B2Publication Date: 2007-04-17
- Inventor: Sungmin Cho , Peter Reimer , Vincent Seidl
- Applicant: Sungmin Cho , Peter Reimer , Vincent Seidl
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: B65G49/07
- IPC: B65G49/07

Abstract:
A method and apparatus for preventing substrate damage in a factory interface. In one embodiment, a method for preventing substrate damage in a factory interface includes the steps of receiving an indicia of potential substrate damage, and automatically preventing substrates from moving out of a substrate storage cassette in response to the received indicia. The indicia may be a seismic warning signal, among others. In another embodiment, a method for preventing substrate damage in a factory interface includes the steps of moving a pod door in a first direction to a position spaced-apart and adjacent a pod, and moving the pod door laterally in a second direction to close the pod. The lateral closing motion of the pod door urges substrates, which may be misaligned in the pod, into a predefined position within the pod.
Public/Granted literature
- US20040013499A1 Semiconductor substrate damage protection system Public/Granted day:2004-01-22
Information query
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