发明授权
- 专利标题： Semiconductor device
- 专利标题（中）： 半导体器件
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申请号： US10662382申请日： 2003-09-16
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公开(公告)号： US07205671B2公开(公告)日： 2007-04-17
- 发明人: Tomonori Kanai , Kiyoharu Kishimoto , Yuji Kikuchi
- 申请人： Tomonori Kanai , Kiyoharu Kishimoto , Yuji Kikuchi
- 申请人地址： JP Ibaraki-shi
- 专利权人： Hitachi Maxell, Ltd.
- 当前专利权人： Hitachi Maxell, Ltd.
- 当前专利权人地址： JP Ibaraki-shi
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 优先权： JP2003-020939 20030129
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L23/48 ; H01L29/40
摘要：
A semiconductor device has peripheral electrode pads formed on the periphery of a semiconductor chip, land pads comprising the first land pads and the second land pads formed on the semiconductor chip, and circuits formed in the semiconductor chip. The peripheral electrode pads are connected to internal circuits by internal lines. The first land pads are connected to the peripheral electrode pads by rewired lines. The second electrode pads, on the other hand, are connected to the internal circuits by internal electrode pads and internal lines, not by the peripheral electrode pads.
公开/授权文献
- US20040145061A1 Semiconductor device 公开/授权日：2004-07-29
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