公开(公告)号：US06603210B2

公开(公告)日：2003-08-05

申请号：US09902746

申请日：2001-07-12

申请人： Kiyoharu Kishimoto ,  Ryuzo Fukao ,  Koji Yamaguchi ,  Hiroyuki Tsukamoto ,  Yuji Yamashita ,  Yuji Kikuchi ,  Tomonori Kanai

发明人： Kiyoharu Kishimoto ,  Ryuzo Fukao ,  Koji Yamaguchi ,  Hiroyuki Tsukamoto ,  Yuji Yamashita ,  Yuji Kikuchi ,  Tomonori Kanai

IPC分类号： H01L2348

CPC分类号： H01L21/6835 ,  H01L21/4846 ,  H01L23/3121 ,  H01L23/498 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/81005 ,  H01L2224/97 ,  H01L2924/07811 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0233 ,  H05K1/113 ,  H05K3/0058 ,  H05K3/205 ,  H05K3/284 ,  H05K3/4644 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/81 ,  H01L2924/00

摘要： For producing a semiconductor module, an electrically insulating layer and an electrically conductive layer are formed on a Nickel-base metal film over a metallic surface, the electrically conductive layer is connected electrically to an electric element through an electrically conductive joint arranged between the electric element and the electrically conductive layer, at least a part of the electric element and at least a part of the electrically conductive joint are covered with a molding resin, and subsequently, the Nickel-base metal film is removed from the metallic surface so that a combination of the Nickel-base metal film, the electrically insulating layer, the electrically conductive layer, the electrically conductive joint and the molding resin is separated from the metallic surface.

公开(公告)号：US07205671B2

公开(公告)日：2007-04-17

申请号：US10662382

申请日：2003-09-16

申请人： Tomonori Kanai ,  Kiyoharu Kishimoto ,  Yuji Kikuchi

发明人： Tomonori Kanai ,  Kiyoharu Kishimoto ,  Yuji Kikuchi

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L24/06 ,  H01L23/3114 ,  H01L23/522 ,  H01L24/05 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device has peripheral electrode pads formed on the periphery of a semiconductor chip, land pads comprising the first land pads and the second land pads formed on the semiconductor chip, and circuits formed in the semiconductor chip. The peripheral electrode pads are connected to internal circuits by internal lines. The first land pads are connected to the peripheral electrode pads by rewired lines. The second electrode pads, on the other hand, are connected to the internal circuits by internal electrode pads and internal lines, not by the peripheral electrode pads.

摘要翻译： 半导体器件具有形成在半导体芯片的周围的外围电极焊盘，包括形成在半导体芯片上的第一焊盘和第二焊盘焊盘的焊盘，以及形成在半导体芯片中的电路。 外围电极焊盘通过内部线路连接到内部电路。 第一焊盘通过重新布线连接到外围电极焊盘。 另一方面，第二电极焊盘通过内部电极焊盘和内部线而不是外围电极焊盘连接到内部电路。

公开(公告)号：US06762075B2

公开(公告)日：2004-07-13

申请号：US10407230

申请日：2003-04-07

申请人： Kiyoharu Kishimoto ,  Ryuzo Fukao ,  Koji Yamaguchi ,  Hiroyuki Tsukamoto ,  Yuji Yamashita ,  Yuji Kikuchi ,  Tomonori Kanai

发明人： Kiyoharu Kishimoto ,  Ryuzo Fukao ,  Koji Yamaguchi ,  Hiroyuki Tsukamoto ,  Yuji Yamashita ,  Yuji Kikuchi ,  Tomonori Kanai

IPC分类号： H01L2144

CPC分类号： H01L21/6835 ,  H01L21/4846 ,  H01L23/3121 ,  H01L23/498 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/81005 ,  H01L2224/97 ,  H01L2924/07811 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0233 ,  H05K1/113 ,  H05K3/0058 ,  H05K3/205 ,  H05K3/284 ,  H05K3/4644 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/81 ,  H01L2924/00

摘要： For producing a semiconductor module, an electrically insulating layer and an electrically conductive layer are formed on a Nickel-base metal film over a metallic surface, the electrically conductive layer is connected electrically to an electric element through an electrically conductive joint arranged between the electric element and the electrically conductive layer, at least a part of the electric element and at least a part of the electrically conductive joint are covered with a molding resin, and subsequently, the Nickel-base metal film is removed from the metallic surface so that a combination of the Nickel-base metal film, the electrically insulating layer, the electrically conductive layer, the electrically conductive joint and the molding resin is separated from the metallic surface.

摘要翻译： 为了制造半导体模块，在金属表面上的镍基金属膜上形成电绝缘层和导电层，导电层通过布置在电气元件之间的导电接头与电气元件电连接 并且所述导电层，所述电气元件的至少一部分和所述导电接头的至少一部分被模制树脂覆盖，随后从所述金属表面去除所述镍基金属膜，使得所述导电层的组合 的镍基金属膜，电绝缘层，导电层，导电接头和模塑树脂与金属表面分离。

公开(公告)号：US06664630B2

公开(公告)日：2003-12-16

申请号：US10270560

申请日：2002-10-16

申请人： Tomonori Kanai ,  Kiyoharu Kishimoto

发明人： Tomonori Kanai ,  Kiyoharu Kishimoto

IPC分类号： H01L2334

CPC分类号： H01L23/5228 ,  H01L23/3114 ,  H01L24/10 ,  H01L2224/05022 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2924/00014

摘要： In a semiconductor device for treating signals of frequency not less than 800 MHz, a minimum thickness of an electrically conductive wire connecting a semiconductor electric circuit in the semiconductor device to an electric member other than the semiconductor device is determined along the following formula: 2 * 2 ω ⁢   ⁢ μ ⁢   ⁢ κ

摘要翻译： 在用于处理频率不低于800MHz的信号的半导体装置中，将半导体装置中的半导体电路与半导体装置以外的电气部件连接的导电线的最小厚度沿下述公式确定：当h 是导电线的最小厚度，κ是导电线的导电率，μ是导电线的磁导率，ω是通过导电线传输的信号的角频率。

公开(公告)号：US06838773B2

公开(公告)日：2005-01-04

申请号：US10311707

申请日：2001-06-20

申请人： Yuji Kikuchi ,  Kiyoharu Kishimoto ,  Kazunari Nakagawa ,  Yoshiharu Hino

发明人： Yuji Kikuchi ,  Kiyoharu Kishimoto ,  Kazunari Nakagawa ,  Yoshiharu Hino

IPC分类号： G06K19/077 ,  H01L21/02 ,  H01L23/31 ,  H01L23/50 ,  H01L23/522 ,  H01L23/525 ,  H01L23/552 ,  H01L23/48

CPC分类号： G06K19/07756 ,  G06K19/07749 ,  G06K19/07775 ,  G06K19/07779 ,  H01L23/3114 ,  H01L23/50 ,  H01L23/5227 ,  H01L23/525 ,  H01L23/552 ,  H01L28/10 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/07811 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/05099

摘要： A semiconductor chip of rewiring layer-integral type capable of preventing a maloperation by noise and a deterioration of communication characteristics and a semiconductor device with excellent communication characteristics; the semiconductor chip, wherein a rewiring layer (3) is formed on a circuit formed surface (1a) through an insulating layer (2) so as to form an antenna coil (4) with the rewiring layer (3), the antenna coil (4) is formed around the periphery of an analog circuit (21) on the circuit formed surface (1a) by avoiding forming on the analog circuit (21), the analog circuit (21) may be formed by collecting analog circuits to be formed in the semiconductor chip (1A) therein, may be one of the particularly noise-susceptible analog circuits such as a power circuit, a calculation amplifier, a comparison amplifier, an RF receiving part, an RF transmitting part, an RF synthesizer part, and a voltage build-up circuit and an amplifying circuit forming a part of a memory part, or may be a coil provided in a part of the analog circuit formed in the semiconductor chip (1A).

摘要翻译： 能够防止噪声误动作和通信特性恶化的半导体芯片，以及具有良好的通信特性的半导体装置; 所述半导体芯片，其中通过绝缘层（2）在电路形成表面（1a）上形成重新布线层（3），以形成具有重新布线层（3）的天线线圈（4），天线线圈 4）通过避免在模拟电路（21）上的形成而形成在电路形成表面（1a）上的模拟电路（21）的周边周围，模拟电路（21）可以通过收集要形成的模拟电路 其中的半导体芯片（1A）可以是诸如电源电路，计算放大器，比较放大器，RF接收部分，RF发射部分，RF合成器部分和特定噪声敏感的模拟电路之一 电压积聚电路和形成存储器部分的一部分的放大电路，或者可以是设置在形成在半导体芯片（1A）中的模拟电路的一部分中的线圈。

公开(公告)号：US07605452B2

公开(公告)日：2009-10-20

申请号：US11519144

申请日：2006-09-12

申请人： Toshihiro Yamanaka ,  Hiroyuki Tsukamoto ,  Kiyoharu Kishimoto

发明人： Toshihiro Yamanaka ,  Hiroyuki Tsukamoto ,  Kiyoharu Kishimoto

IPC分类号： H01L23/495 ,  H01L23/12

CPC分类号： H01L23/5386 ,  H01L23/147 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/16 ,  H01L2924/3025

摘要： A semiconductor light-emitting device according to an embodiment of the present invention includes chip LEDs formed on a silicon submount, in which a wiring pattern having a chip connecting terminal portion connecting the chip LEDs, an external connecting terminal portion connecting an external unit, and a plurality of lead portions connecting a corresponding chip connecting terminal portion and a corresponding external connecting terminal portion is formed on the silicon submount, and an area of the chip connecting terminal portions is made larger than an area of a region where the chip connecting terminal portion overlaps with the chip LEDs. Accordingly, a semiconductor light-emitting device of high heat radiation property and heat resistance can be provided.

摘要翻译： 根据本发明实施例的半导体发光器件包括形成在硅基座上的芯片LED，其中具有连接芯片LED的芯片连接端子部分的布线图案，连接外部单元的外部连接端子部分和 在硅基座上形成有连接相应的芯片连接端子部分和对应的外部连接端子部分的多个引线部分，使芯片连接端子部分的区域大于芯片连接端子部分 与芯片LED重叠。 因此，可以提供具有高散热性和耐热性的半导体发光器件。

公开(公告)号：US06840448B2

公开(公告)日：2005-01-11

申请号：US10462840

申请日：2003-06-17

申请人： Shinichiro Fukushima ,  Yutaka Takami ,  Atsushi Yoshioka ,  Isao Nakagawa ,  Shuzo Matsumoto ,  Kiyoharu Kishimoto

发明人： Shinichiro Fukushima ,  Yutaka Takami ,  Atsushi Yoshioka ,  Isao Nakagawa ,  Shuzo Matsumoto ,  Kiyoharu Kishimoto

IPC分类号： G06F15/02 ,  G06K7/00 ,  G06K7/08 ,  G06K7/10 ,  G06K17/00 ,  G06K19/07 ,  H04B5/02 ,  H04M1/21

CPC分类号： G06K7/0008 ,  G06K7/10178 ,  G06K7/10336

摘要： When an IC card module is used for a small portable information apparatus such as a portable telephone terminal, the module has a size much smaller than an ordinary IC card from the viewpoint that the apparatus is required to be small in size and weight. In the case of a small non-contact type card, there are problems that an antenna coil cannot secure its necessary surface area, a necessary power cannot be obtained for a signal to be transmitted or received, a communication distance from an external device becomes small. When the signal is transmitted and received via a booster coil provided between the external device and the antenna coil of the IC card module, the effective surface area of the antenna coil can be increased and the communication distance can be increased to a level as large as it can practically avoid involvement of any problem.

摘要翻译： 当将IC卡模块用于诸如便携式电话终端之类的小型便携式信息装置时，该模块的尺寸远小于普通IC卡，因为该装置的尺寸和重量要小。 在小型非接触型卡的情况下，存在天线线圈不能确保其必要表面积的问题，对于要发送或接收的信号不能获得必需的功率，从外部设备的通信距离变小 。 当通过设置在IC卡模块的外部设备和天线线圈之间的升压线圈发送和接收信号时，可以增加天线线圈的有效表面积，并且可以将通信距离提高到与 它实际上可以避免任何问题的参与。

公开(公告)号：US20100067757A1

公开(公告)日：2010-03-18

申请号：US12560089

申请日：2009-09-15

申请人： Shinichi ARAI ,  Hiroyuki Tsukamoto ,  Kiyoharu Kishimoto

发明人： Shinichi ARAI ,  Hiroyuki Tsukamoto ,  Kiyoharu Kishimoto

IPC分类号： G06K9/00 ,  H01J3/00

CPC分类号： G06K9/0004 ,  G06K2009/00932

摘要： An image acquisition apparatus includes an image pickup device that includes a plurality of pixels, and a filter layer that blocks propagation of an incident light ray which comes from an object side to the pixel side in accordance with an increase in incident angle of the incident light ray.

摘要翻译： 一种图像获取装置包括：包括多个像素的图像拾取装置和根据入射光的入射角的增加阻挡从物体侧入射到像素侧的入射光的传播的滤光层 射线。

公开(公告)号：US06466272B1

公开(公告)日：2002-10-15

申请号：US09109179

申请日：1998-07-02

申请人： Ikuya Arai ,  Kouji Kitou ,  Masahiro Eto ,  Ryuuichi Someya ,  Kiyoharu Kishimoto

发明人： Ikuya Arai ,  Kouji Kitou ,  Masahiro Eto ,  Ryuuichi Someya ,  Kiyoharu Kishimoto

IPC分类号： H04N701

CPC分类号： G09G1/165 ,  G09G5/18 ,  H04N5/46 ,  H04N7/0105 ,  H04N7/0135 ,  H04N7/0137

摘要： A display apparatus capable of receiving and displaying video signals which differ in scanning frequencies or resolutions. The display apparatus includes an input section for receiving at least one video signal and a conversion unit for converting at least one of the frequency and resolution of the at least one received video signal so as to be within predetermined higher ranges thereof. A display unit enables display of the converted received at least one video signal.

摘要翻译： 一种能够接收和显示扫描频率或分辨率不同的视频信号的显示装置。 显示装置包括用于接收至少一个视频信号的输入部分和用于将至少一个接收的视频信号的频率和分辨率中的至少一个转换成其预定的较高范围的转换单元。 显示单元能够显示经转换的接收到的至少一个视频信号。

公开(公告)号：US20070080438A1

公开(公告)日：2007-04-12

申请号：US11519144

申请日：2006-09-12

申请人： Toshihiro Yamanaka ,  Hiroyuki Tsukamoto ,  Kiyoharu Kishimoto

发明人： Toshihiro Yamanaka ,  Hiroyuki Tsukamoto ,  Kiyoharu Kishimoto

IPC分类号： H01L23/495

CPC分类号： H01L23/5386 ,  H01L23/147 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/16 ,  H01L2924/3025

摘要： A semiconductor light-emitting device according to an embodiment of the present invention includes chip LEDs formed on a silicon submount, in which a wiring pattern having a chip connecting terminal portion connecting the chip LEDs, an external connecting terminal portion connecting an external unit, and a plurality of lead portions connecting a corresponding chip connecting terminal portion and a corresponding external connecting terminal portion is formed on the silicon submount, and an area of the chip connecting terminal portions is made larger than an area of a region where the chip connecting terminal portion overlaps with the chip LEDs. Accordingly, a semiconductor light-emitting device of high heat radiation property and heat resistance can be provided.

摘要翻译： 根据本发明实施例的半导体发光器件包括形成在硅基座上的芯片LED，其中具有连接芯片LED的芯片连接端子部分的布线图案，连接外部单元的外部连接端子部分和 在硅基座上形成有连接相应的芯片连接端子部分和对应的外部连接端子部分的多个引线部分，使芯片连接端子部分的区域大于芯片连接端子部分 与芯片LED重叠。 因此，可以提供具有高散热性和耐热性的半导体发光器件。