发明授权
- 专利标题： Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate
- 专利标题（中）： 具有通过金属板电连接到半导体元件的电路板的电子电路装置
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申请号： US11069975申请日： 2005-03-03
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公开(公告)号： US07208833B2公开(公告)日： 2007-04-24
- 发明人: Kazuhiro Nobori , Satoshi Ikeda , Yasushi Kato , Yasufumi Nakajima
- 申请人： Kazuhiro Nobori , Satoshi Ikeda , Yasushi Kato , Yasufumi Nakajima
- 申请人地址： JP Osaka
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP2001-8823 20010117
- 主分类号： H01L25/07
- IPC分类号： H01L25/07 ; H01L23/04 ; H01L23/34 ; H01L23/10 ; B23K31/02
摘要：
An electronic circuit device comprises: a semiconductor element having a first surface and a second surface, with the first and second surfaces being on first and second sides of the semiconductor element, respectively, and facing in opposite directions; a first electrode on the first surface; a second electrode on the second surface; a first circuit board electrically connected to the first electrode via a metallic plate such that the metallic plate and the semiconductor element are on the first circuit board; a second circuit board on the second side of the semiconductor element, the second circuit board having a control circuit for the semiconductor element; and a metallic wire for directly electrically interconnecting the second electrode and the second circuit board.
公开/授权文献
- US20050148237A1 Electronic circuit device 公开/授权日：2005-07-07
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