发明授权
US07209366B2 Delivery regions for power, ground and I/O signal paths in an IC package
有权
IC封装中的电源，接地和I / O信号通路的交付区域
- 专利标题： Delivery regions for power, ground and I/O signal paths in an IC package
- 专利标题（中）： IC封装中的电源，接地和I / O信号通路的交付区域
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申请号： US10804800申请日： 2004-03-19
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公开(公告)号： US07209366B2公开(公告)日： 2007-04-24
- 发明人: Victor Prokofiev , Cengiz A. Palanduz
- 申请人： Victor Prokofiev , Cengiz A. Palanduz
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Schwabe, Williamson & Wyatt, P.C.
- 主分类号： H05K1/11
- IPC分类号： H05K1/11
摘要：
An integrated circuit (IC) package includes a chip carrier and a chip mounted to the chip carrier. The chip carrier has a centrally located power delivery region and a peripherally located input-output (I/O) delivery region disposed in partially surrounding relationship to the power delivery region. Power and ground paths are disposed in the power delivery region and I/O signal paths are disposed in the I/O delivery region.
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