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发明授权
US07209544B2 X-ray tube cathode assembly and interface reaction joining process 有权
X射线管阴极组件和界面反应连接工艺

X-ray tube cathode assembly and interface reaction joining process
摘要：
An x-ray tube cathode assembly (28) includes a support arm (36) comprising a first metal. A ceramic insulator (70, 82) has a first metalized surface (72, 86) wherein the metalized surfaces comprise a desired amount of the first metal. A first member of filler material (90) is in contact with the support arm (36) and the first metalized surface (72, 86) of the ceramic insulator (70, 82), the first member of filler material comprising at least a second metal (96a, 96b) wherein a first alloy system (FIG. 5) comprising the first and second metals includes an alloy minimum point percentage composition (P) of the first and second metals having a first alloy system minimum melting point (M) for the alloy minimum point percentage composition that is lower than both of the melting point of the first metal and second metal. A bonding region resulting from heating the cathode assembly causing diffusion bonding to proceed, the bonding region has a layer of alloy comprising the minimum point percentage composition (P) and the heating of the cathode assembly continues to a bonding temperature of at least the first alloy system minimum melting point (M) and holding at that temperature for a desired period of time.
摘要（中）：

X射线管阴极组件（28）包括包括第一金属的支撑臂（36）。 陶瓷绝缘体（70,82）具有第一金属化表面（72,86），其中金属化表面包含所需量的第一金属。 填充材料（90）的第一部件与陶瓷绝缘体（70,82）的支撑臂（36）和第一金属化表面（72,86）接触，第一填料材料包括至少第二个 金属（96a，96b），其中包括第一和第二金属的第一合金系统（图5）包括第一和第二金属的合金最小点百分比组成（P），其具有第一合金系统的最小熔点（M ），其低于第一金属和第二金属的熔点两者的合金最小点百分比组成。 通过加热阴极组件导致扩散接合而进行的接合区域，接合区域具有包含最小点百分比组成（P）的合金层，并且阴极组件的加热持续至少第一合金的接合温度 系统最小熔点（M），并在该温度下保持所需的时间。

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