发明授权
- 专利标题: Method and apparatus for molding bead
- 专利标题(中): 珠粒成型方法及装置
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申请号: US10819178申请日: 2004-04-07
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公开(公告)号: US07211162B2公开(公告)日: 2007-05-01
- 发明人: Shinji Okuda , Masaharu Takada , Hitoshi Fujii
- 申请人: Shinji Okuda , Masaharu Takada , Hitoshi Fujii
- 申请人地址: JP Osaka CH Ecublens
- 专利权人: Sunstar Giken Kabushiki Kaisha,Sunstar Suisse SA
- 当前专利权人: Sunstar Giken Kabushiki Kaisha,Sunstar Suisse SA
- 当前专利权人地址: JP Osaka CH Ecublens
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 优先权: JP322177/1998 19981112
- 主分类号: B32B5/20
- IPC分类号: B32B5/20
摘要:
A hollow bead of high quality is applied and molded into a shape corresponding to and following a shape of an applying position onto which the bead is to be applied. A bead-molding apparatus includes a discharging device of a double nozzle structure comprised of an inner nozzle and an outer nozzle, a highly viscous material feed unit for feeding a highly viscous material that is fluid in a form of a stream in a high speed flow region and can retain a shape into which it is applied and molded in a low speed flow region, a manipulator disposed so as to transfer the discharging device mounted thereon to a desired position, and a controller for controlling overall operations of the apparatus. The discharging device is controlled so as to move along the applying position of a member while feeding gases thereto from the inner nozzle and discharging the highly viscous material thereto from the outer nozzle.
公开/授权文献
- US20040188001A1 Method and apparatus for mounting bead 公开/授权日:2004-09-30
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