Invention Grant
- Patent Title: Method for forming stencil
- Patent Title (中): 形成模板的方法
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Application No.: US10689471Application Date: 2003-10-20
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Publication No.: US07213331B2Publication Date: 2007-05-08
- Inventor: Tongbi Jiang , Edward A. Schrock
- Applicant: Tongbi Jiang , Edward A. Schrock
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Fletcher Yoder
- Main IPC: H05K3/34
- IPC: H05K3/34
Abstract:
A method of forming a stencil for the manufacture of semiconductor devices includes defining a plurality of slightly spaced segmental annular openings in a stencil plate. The spacing between the segmental annular openings define spokes extending from a central portion of said stencil connected via those spokes to the rest of the stencil plate. The spokes extend past two adjacent annular segments.
Public/Granted literature
- US20040078967A1 Z-axis electrical contact for microelectronic devices Public/Granted day:2004-04-29
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