发明授权
- 专利标题: Lead wire bonding method
- 专利标题(中): 引线接合方法
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申请号: US10963504申请日: 2004-10-14
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公开(公告)号: US07213741B2公开(公告)日: 2007-05-08
- 发明人: Atsushi Oohashi
- 申请人: Atsushi Oohashi
- 申请人地址: JP Tokyo
- 专利权人: Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人: Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址: JP Tokyo
- 代理机构: Sughrue Mion, PLLC
- 优先权: JP2004-145871 20040517
- 主分类号: B23K31/02
- IPC分类号: B23K31/02
摘要:
After respective one ends of lead wires are fixed to a printed circuit board, the lead wires are bent, the printed circuit board is brought into a case and the other ends of the lead wires are bonded to terminals of the case. Since the lead wires are processed before the substrate is brought into the case, this eliminates the necessity to perform formation of the bent portions of the lead wires and fixing of the lead wires to the substrate in a narrow space of the case and allows simplification of bonding operation. Thus provided is a lead wire bonding method for bonding lead wires with bent portions to the substrate, which simplifies a bonding operation.
公开/授权文献
- US20050252948A1 Lead wire bonding method 公开/授权日:2005-11-17